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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                High speed hot bar soldering machine, PCB bonding soldering machine, FPC board soldering machine
                              

Peso:	110 kg	Poder:	10 kw
Tensão:	220V/380V	Modelo:	YSPC-1A
Área de Trabalho:	200*260mm	Força de ligação:	3.900N
Capacidade de pitch:	0,25mm	Componentes principais:	PLC, caixa de engrenagens, motor, bomba
Controle de temperatura:	PID de malha fechada	Controle de pressão:	Programável digitalmente
Tempo de ciclo:	Extremamente curto	Tipo de Termodo:	Flutuante
Sistema de alinhamento:	Micrômetro/vácuo	CCD opcional:	Moldura, câmera, lente
Tipo de controlador:	baseado em microprocessador

Peso:	110 kg
Poder:	10 kw
Tensão:	220V/380V
Modelo:	YSPC-1A
Área de Trabalho:	200*260mm
Força de ligação:	3.900N
Capacidade de pitch:	0,25mm
Componentes principais:	PLC, caixa de engrenagens, motor, bomba
Controle de temperatura:	PID de malha fechada
Controle de pressão:	Programável digitalmente
Tempo de ciclo:	Extremamente curto
Tipo de Termodo:	Flutuante
Sistema de alinhamento:	Micrômetro/vácuo
CCD opcional:	Moldura, câmera, lente
Tipo de controlador:	baseado em microprocessador

High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board

High Speed Hot Bar Soldering Machine for PCB and FPC Board Bonding

Advanced hot bar soldering system designed for precision bonding of printed circuit boards and flexible printed circuits with exceptional speed and accuracy.

Technical Details

Microprocessor-based controller provides precise and consistent temperature control
Unique pulsed heat thermos offers uniform temperature distribution with fast heating and cool-down
Flexible programmable profiles for targeted idle, preheat and reflow heating
Floating thermos and digital pressure switch ensure optimal pressure distribution across joints
CCD camera system with magnification lens available for fine-pitch positioning

Key Features

Extremely short cycle time with rotary table design
Product loading and unloading during heat sealing process
High quality heat seal application up to 0.25mm pitch
Pneumatic bonding head provides up to 3,900N force
Digital programmable pressure control with LCD display
Closed loop PID temperature control with visible LED display
Bonding cycle triggered by real-time pressure sensor
Floating Thermode ensures consistent pressure and heat transfer
Precision product fixtures with micrometer alignment and vacuum component fixation
Optional CCD alignment module for fine pitch applications
Full microprocessor logic control

Customer Support Advantages

Engineer overseas training for customers
Prompt technical support services
Rapid complaint handling with 30-minute response time
Reliable manufacturing with 15+ experts each having over six years of experience

Technical Specifications