Destacar: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                CCD automatic PCB depaneling machine, high precision PCB router machine, online PCB depaneling equipment
                              

Peso:	3500 kg	Poder:	10 kw
Tensão:	220V, 110V	Modelo:	YASTM-4C
Precisão:	μm ±20	Comprimento de onda do laser:	355 nm
potência do laser:	10W	Espessura do material:	≤1,2mm
Precisão da plataforma:	μm ±2	Área de Trabalho:	600*450 mm
Potência máxima:	3 kW	Diâmetro do Feixe:	20±5 μm
temperatura ambiente:	20±2 ℃	Material da máquina:	Mármore
Dimensões:	1480mm1360mm1412mm

Peso:	3500 kg
Poder:	10 kw
Tensão:	220V, 110V
Modelo:	YASTM-4C
Precisão:	μm ±20
Comprimento de onda do laser:	355 nm
potência do laser:	10W
Espessura do material:	≤1,2mm
Precisão da plataforma:	μm ±2
Área de Trabalho:	600*450 mm
Potência máxima:	3 kW
Diâmetro do Feixe:	20±5 μm
temperatura ambiente:	20±2 ℃
Material da máquina:	Mármore
Dimensões:	1480mm1360mm1412mm

High Precision CCD Automatic Positioning/online Pcb Router Machine

High Precision CCD Automatic Positioning Online PCB Router Machine

Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards

450×430 mm 15W UV PCB Separator / FR4 Board Laser Depaneling Machine with ±20 μm Precision

Advanced Laser Depaneling Technology

Completely software-controlled laser process with adaptable processing parameters and laser paths for varying materials and cutting contours
UV laser cutting eliminates appreciable mechanical or thermal stresses on components
Minimal cutting channel requirement (few µm) enables higher component density on panels
Dual-mode system software separates production and setup processes to reduce operator errors
Integrated vision system with fiducial recognition operates 100% faster than previous versions

YASTM-4C Laser Depanelizer Machine Features

High Precision Positioning: CCD automatic positioning with automatic focusing for fast, accurate operation
User-Friendly Design: Simple interface, easy operation, compact footprint, and rigorous security design
Energy Efficient: Reduced energy consumption for significant cost savings
High Performance: Cost-effective solution with fast cutting speed and stable performance

YASTM-4C Technical Specifications

Parameter	Specification
Technical Parameters	Main body of laser: 1480mm × 1360mm × 1412mm
Power	AC220 V
Laser Type	355 nm
Laser Source	Optowave 10W (US)
Material Thickness	≤1.2 mm
Precision	±20 μm
Platform Precision	±2 μm
Working Area	600 × 450 mm
Maximum Power	3 KW
Vibration Control	CTI (US)
Beam Diameter	20±5 μm
Ambient Temperature	20±2 ℃
Machine Base	Marble