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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                PCB laser depaneling machine, FPC UV laser depanelizer, high precision PCB laser cutter
                              

Peso:	1600kg	Marca a laser:	Optowave
potência do laser:	10W	Comprimento de onda do laser:	355 nm
Fonte de energia:	AC220 V	Espessura do material:	≤1,2mm
Precisão de corte:	μm ±20	Precisão da plataforma:	μm ±2
Área de Trabalho:	600*450 mm	Potência máxima:	3 kW
Diâmetro do Feixe:	20±5 μm	temperatura ambiente:	20±2 ℃
Umidade Ambiente:	<60%	Material da máquina:	Mármore
Dimensões:	1480mm1360mm1412 milímetro

Peso:	1600kg
Marca a laser:	Optowave
potência do laser:	10W
Comprimento de onda do laser:	355 nm
Fonte de energia:	AC220 V
Espessura do material:	≤1,2mm
Precisão de corte:	μm ±20
Precisão da plataforma:	μm ±2
Área de Trabalho:	600*450 mm
Potência máxima:	3 kW
Diâmetro do Feixe:	20±5 μm
temperatura ambiente:	20±2 ℃
Umidade Ambiente:	<60%
Material da máquina:	Mármore
Dimensões:	1480mm1360mm1412 milímetro

PCB Laser Depanelizer Machine. FPC UV Laser Depaneizer,High Precision Pcb Laser Cutting Equipment

PCB Laser Depanelizer Machine

FPC UV Laser Depanelizer - High Precision PCB Laser Cutting Equipment

Inline Laser Cutting Machine for Flexible Circuit Boards without Stress

Cutting Applications

FPC and related materials
FPC/PCB/Rigid-Flex PCB cutting
Camera module cutting

Key Features

Fast and efficient operation, reducing delivery time
High quality results with no distortion and clean, uniform surfaces
Integration of CNC technology, laser technology, and software technology
High accuracy and high-speed performance

Advantages of Laser PCB Depaneling/Singulation

No mechanical stress on substrates or circuits
No tooling cost or consumables required
Versatile applications with simple setting changes
Fiducial recognition for precise and clean cuts
Optical recognition before depaneling process begins
Ability to depanel virtually any substrate (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc.)
Extraordinary cut quality holding tolerances as small as < 50 microns
No design limitations - ability to cut virtually any size PCB board including complex contours and multidimensional boards

Technical Specifications

Parameter	Specification
Technical Parameters	Main body of laser: 1480mm × 1360mm × 1412mm
Power	AC220 V
Laser Wavelength	355 nm
Laser Source	Optowave 10W (US)
Material Thickness	≤ 1.2 mm
Precision	±20 μm
Platform Accuracy	±2 μm
Working Area	600 × 450 mm
Maximum Power	3 KW
Vibrating Mirror	CTI (US)
Spot Diameter	20 ± 5 μm
Ambient Temperature	20 ± 2 ℃
Ambient Humidity	< 60%
Machine Base	Marble