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                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                BGA rework station with optical alignment, ZM-R7220A BGA rework machine, PCB depaneling BGA station
                              

Tensão:	220 V	Poder:	5650W
Peso:	76 kg	Dimensões:	685633850mm
Potência do aquecedor superior:	1450W	Potência do aquecedor de fundo:	1200W
Potência do aquecedor IR:	2700W	Precisão de temperatura:	± 3 ℃
Tamanho máximo da PCB:	415×370mm	Tamanho mínimo da PCB:	6×6mm
Chip BGA máximo:	60×60mm	Chip BGA mínimo:	2×2mm
Precisão de montagem:	±0,02mm	Ampliação óptica:	230X
Freqüência:	50/60Hz

Tensão:	220 V
Poder:	5650W
Peso:	76 kg
Dimensões:	685633850mm
Potência do aquecedor superior:	1450W
Potência do aquecedor de fundo:	1200W
Potência do aquecedor IR:	2700W
Precisão de temperatura:	± 3 ℃
Tamanho máximo da PCB:	415×370mm
Tamanho mínimo da PCB:	6×6mm
Chip BGA máximo:	60×60mm
Chip BGA mínimo:	2×2mm
Precisão de montagem:	±0,02mm
Ampliação óptica:	230X
Freqüência:	50/60Hz

High Quality ZM-R7220A BGA rework station with optical alignment

ZM-R7220A BGA Rework Station with Optical Alignment

Product Applications

This high-precision BGA rework station is designed for professional PCB repair and component replacement applications:

De-solder and solder all types of BGA components (lead-free and leaded)
Remove and repair motherboard BGA IC chips and other components
Reduce production costs by reworking defective solder joints during PCB assembly
Rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and other chipset types
Ideal for high-precision motherboard rework in laptops, gaming consoles, mobile phones, and electronic devices

Key Features

Advanced Heating System

Large area infrared carbon fiber pre-heating system for fast, even heating without light pollution
Independent control of top, bottom, and IR heaters with ±3℃ temperature accuracy
Ten-segment temperature control process suitable for all BGA rework applications
Adjustable IR preheating area for uniform PCB heating

Precision Optical Alignment

Adjustable CCD color optical system with beam split, zoom, and micro-adjust functions
Automatic chromatism resolution and brightness adjustment
230X magnification with mounting accuracy within ±0.02mm
Prevents eye strain during extended rework sessions

Smart Operation System

High-definition human-machine interface with authority-protected temperature parameters
Automatic soldering and de-soldering functions with no manual adjustment required
Unlimited temperature profile storage with one-key recall capability
USB connection with driver-free PC control
360° rotating BGA nozzle system with easy installation and replacement

Safety & Protection

CE certified with comprehensive safety protection functions
Automatic power-off circuit when temperature exceeds control limits
Password-protected temperature parameters to prevent unauthorized changes
Completion alarms and double protection systems
Protects PCB components and machine from damage during abnormal conditions

Technical Specifications

Power Supply	AC 220V ±10%, 50/60 Hz
Total Power	Max 5650W
Heater Power	Top: 1450W, Bottom: 1200W, IR: 2700W
Temperature Control	K-type thermocouple (Closed Loop), ±3℃ accuracy
PCB Size Range	Max: 415 × 370 mm, Min: 6 × 6 mm
BGA Chip Size	Max: 60 × 60 mm, Min: 2 × 2 mm
Positioning System	V-groove PCB support with universal fixture
Dimensions	685 × 633 × 850 mm (L × W × H)
Weight	76 kg
Color	White